Call for Papers - Special Issue on Applications of Wide Bandgap Devices

Call for Papers
 
Special Issue on Applications of Wide Bandgap Devices, 2018
 
The emergence of wide bandgap (WBG) semiconductor devices such as silicon carbide (SiC) and gallium nitride (GaN) devices promises to revolutionize next-generation power electronics converters. Featuring high breakdown electric field, low specific on-resistance, fast switching speed, and high junction temperature capability, these devices are beneficial for the efficiency, power density, reliability, and/or cost of power electronics converters. Applications of WBG devices have been seen in the electric utility grid, transportation, industrial motor drives, power supplies, and consumer electronic products. And more emerging applications can be expected. However, extremely fast switching and other superior characteristics of WBG device, and high switching frequency/high voltage/high junction temperature operation, present new design challenges in gate drive, packaging and layout, EMI suppression, converter control, etc. Addressing these design and application issues is critical to the adoption, commercialization, and success of WBG based power electronics. This special issue intends to publish the latest results on these important application topics.
 
Prospective researchers are invited to submit original contributions or survey papers for peer review for publication in CPSS Transactions on Power Electronics and Applications. Topics of interest of this Special Issue include, but are not limited to:
• Application in motor drives
• Gate drive, protection and other auxiliary circuits
• Applications in renewable energy, energy storage, and grid
• Packaging and passive components
• Transportation applications
• EMI issues and solutions
• Applications in communications, digital systems, and data centers
• High-quality sensing and control
• Emerging applications of WBG devices
• Design methodologies for WBG power electronics
 
The manuscripts should be submitted through Manuscript Central at https://mc03.manuscriptcentral.com/tpea-cpss. Submissions must be clearly marked “Special Issue on Applications of Wide Bandgap Devices, 2018” on the cover page. The information about manuscript preparation and requirements is provided onhttp://tpea.cpss.org.cn/a/For_Authors/. Manuscripts submitted to this Special Issue will be reviewed and handled by the guest editorial board as noted below.
 
 
 
Deadline for Submission of Manuscripts: November 11, 2018
 
Guest Editor-in-Chief: Fei (Fred) Wang, University of Tennessee, Knoxville, USA   
 
Guest Co-Editor-in-Chief:Bo Liu, University of Tennessee, Knoxville, USA
 
 
Guest Associate Editors: 
Layi Alatise, The University of Warwick, UK
Fang Luo, University of Arkansas, USA
Hua (Kevin) Bai, University of Tennessee, Knoxville, USA
Dong Jiang, Huazhong University of Science and Technology, China
Dong Cao, North Dakota State University, USA
Jin Wang, The Ohio State University, USA
Dong Dong, Virginia Tech, USA
Jun Wang, Virginia Tech, USA
Ben Guo, United Technologies Research Center, USA
Laili Wang, Xi’an Jiaotong University, China
Shiqi Ji, University of Tennessee, Knoxville, USA
Mengqi (Maggie) Wang, University of Michigan-Dearborn, USA
Puqi Ning, Chinese Academy of Sciences, China
Shuo Wang, University of Florida, USA
Edward Jones, Efficient Power Conversion, USA
Jing Xu, ABB Corporate Research, USA
Hui (Helen) Li, Florida State University, USA
Xibo Yuan, University of Bristol, UK
Qiang Li, Virginia Tech, USA
Zheyu Zhang, General Electric Global Research, USA
 
 
Proposed Timeline:
•November 11, 2018– Manuscripts submission deadline
•December 5, 2018 – Final acceptance notification
•December 31, 2018 – Camera-ready manuscripts for publication